iPhone 18 series in 2026 will feature a next-generation A20 chip built using a 2 nanometer fabrication process by TSMC. This will also allow support for up to 12GB of RAM in iPhone 18 models.

As per a new post on Chinese social media website Weibo by “Phone Chip Expert” account, the A20 chip will feature a change from InFo (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip) packaging, alongside a memory bump to 12GB.

What is InFo, you ask? InFo packaging integrates different components into a single-die packaging, with memory attached to the system-on-chip. This typically includes the DRAM being placed near the CPU and GPU cores. This helps in reducing the size of the package, while improving the performance of the chips.

On the other hand, WMCM will enable integration of multiple chips in the same package. This will allow different chips to be part of the same package, including CPU, GPU, DRAM, Neural Engine, etc. This enable horizontal and vertical stacking and optimizes performance.

Regarding the RAM upgrade, Ming-Chi Kuo recently mentioned that iPhone 17 Pro will feature 12GB of RAM – it is likely that non-Pro iPhone 18 models will get 12GB of RAM too later onwards. However, considering that only the Pro models are expected to get the new 2nm A20 chip in 2026, it is unclear whether the RAM upgrade will be due to the new fabrication process or not.

Apple was the first smartphone maker to jump to the 3nm process and will very likely be the first one to release a 2nm chip too. Even though TSMC will start manufacturing 2nm chips in 2025, Apple’s demand will likely be met by 2026 to ensure that it can meet the demand that iPhone sales can generate.

via MacRumors

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